document number: mpx4115 rev 5, 08/2006 freescale semiconductor technical data ? freescale semiconductor, in c., 2006. all rights reserved. integrated silicon pressure sensor altimeter/barometer pressure sensor on-chip signal conditioned, temperature compensated and calibrated the mpx4115 series is designed to sense absolute air pressure in an altimeter or barometer (bap) applications. freesca le's bap sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high level analog output signal and temperature co mpensation. the small form factor and high reliability of on-chi p integration makes the free scale bap sensor a logical and economical choice for application designers. features ? 1.5% maximum error over 0 to 85 ? ideally suited for mi croprocessor or microcontroller-based systems ? available in absolute, differential and gauge configurations ? durable epoxy unibody element ? easy-to-use chip carrier option typical applications ? altimeter ? baromete ordering information (1) 1. the mpx4115a bap sensor is available in th e basic element package or with pressure port fittings that provide mounti ng ease and barbed hose connections. device options case no. mpx series order no. marking basic element absolute, element only case 867-08 mpx4115a mpx4115a ported elements absolute, ported case 867b-04 mpx4115ap mpx4115ap absolute, stove pipe port case 867e-03 mpx4115as mpx4115a absolute, axial port case 867f-03 MPX4115ASX mpx4115a mpx4115 series operating overview integrated pressure sensor 15 to 115kpa (2.18 to 16.7 psi) 0.2 to 4.8 volts output mpx4115a case 867-08 pin numbers 1 v out (1) 1. pin 1 is noted by the notch in the lead. 4 n/c (2) 2. pins 4, 5, and 6 are internal device connections. pin 1 is noted by the notch in the lead. do not connect to external circuitry or ground. 2 gnd 5 n/c (2) 3 v s 6 n/c (2) mpx4115ap case 867b-04 mpx4115as case 867e-03 MPX4115ASX case 867f-03
sensors 2 freescale semiconductor mpx4115 series figure 1. integrated pressure sensor schematic table 1. maximum ratings (1) 1. t c = 25 c unless otherwise noted. parametrics symbol value unit overpressure (2) (p1 > p2) 2. exposure beyond the specified limits may cause permanent damage or degradation to the device. p max 400 kpa burst pressure (2) (p1 > p2) p burst 1000 kpa storage temperature t stg -40 to +125 c operating temperature t a -40 to +125 c sensing element gnd v out v s pins 4, 5, and 6 are no connects thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry
sensors freescale semiconductor 3 mpx4115 series table 2. operating characteristics (v s = 5.1 vdc, t a = 25 c unless otherwise noted, p1 > p2 decoupling circuit shown in figure 3 required to meet electrical specifications.) characteristic symbol min typ max unit pressure range (1) 1. 1.0kpa (kilopascal) equals 0.145 psi. p op 15 - 115 kpa supply voltage (2) 2. device is ratiometric within this specified excitation range. v s 4.85 5.1 5.35 vdc supply current i o ?7.010madc minimum pressure offset (3) (0 to 85 c) @ v s = 5.1 volts 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off 0.135 0.204 0.273 vdc full scale output(4) (0 to 85 c) @ v s = 5.1 volts 4. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. v fso 4.725 4.794 4.863 vdc full scale span(5) (0 to 85 c) @ v s = 5.1 volts 5. full scale span (v fss ) is defined as the algebraic difference between the output vo ltage at full rated pressure and the output voltage at the minimum rated pressure. v fss ?4.59?vdc accuracy (6) (0 to 85 c) 6. accuracy (error budget) consists of the following: linearity:output deviation from a straight line relationship wi th pressure, using end point met hod, over the specified pressure range. temperature hysteresis:output deviation at any temperature within the operating temper ature range, after the temperature is cyc led to and from the minimum or maximum operating temperature points, with zero differential pressure applied. pressure hysteresis:outpu t deviation at any pressure within the specified range, when this pres sure is cycled to and from the minimum or maximum rated pressure at 25 c. tcspan:output deviation over the temperature range of 0 to 85 c, relative to 25 c. tcoffset:output deviation with minimum pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. variation from nominal:the variation fr om nominal values, for offset or full scale span, as a percent of v fss at 25 c. ??? 1.5 %v fss sensitivity v/p ? 46 ? mv/kpa response time (7) 7. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ?1.0?ms output source current at full scale output l o +?0.1?madc warm-up time (8) 8. warm-up is defined as the ti me required for the product to meet the specifi ed output voltage after the pressure has been stab ilized. ??20?msec offset stability (9) 9. offset stability is the product's output deviation when subjected to 1000 hours of pu lsed pressure, temperature cycling with bias test. ?? 0.5 ? %v fss table 3. mechanical characteristics characteristic symbol min typ max unit weight, basic element (case 867) ? ? 4.0 ? grams common mode line pressure (1) 1. common mode pressures beyond what is specified ma y result in leakage at the case-to-lead interface. ???690kpa
sensors 4 freescale semiconductor mpx4115 series figure 2 illustrates the absolute sensing chip in the basic chip carrier (case 867). a fluorosilicone gel isolates the die surface and wire bonds from t he environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. the mpx4115a series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. media, other than dry air, may have adverse effects on sensor performance and long-term reliability. contact the factory for information regarding media compatibility in your application. figure 4 shows the sensor output signal relative to pressure input. typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85 c. (the output will saturate outside of the specified pressure range.) figure 2. cross-sectional diagram (not to scale) figure 3. recommended power supply decoupling. (for output filtering reco mmendations, please refer to application note an1646.) figure 4. output versus absolute pressure fluoro silicone gel die coat die p1 metal cover epoxy plastic case absolute element p2 lead frame wire bond die bond stainless steel sealed vacuum reference ips 1 2 3 output 1.0 f 0.01 f +5.0 v 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 transfer function: v out = v s * (.009*p-.095) error v s = 5.1 vdc temp = 0 to 85 c pressure (ref. to sealed vacuum) in kpa typ max min 5.0 4.5 3.5 4.0 3.0 2.5 2.0 1.5 1.0 0 0.5 output (volts)
sensors freescale semiconductor 5 mpx4115 series nominal transfer value: v out = v s (p x 0.009 - 0.095) (pressure error x temp. factor x 0.009 x v s ) v s = 5.1 v 0.25 vdc transfer function (mpx4115) mpx4115a series temp multiplier - 40 3 0 to 85 1 +125 3 temperature in c 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 140 120 100 80 temperature error factor temperature error band pressure error (max) 9.0 6.0 3.0 -3.0 -6.0 -9.0 0.0 pressure (in kpa) pressure error (kpa) 15 to 115 (kpa) 1.5 (kpa) pressure error band 30 40 50 60 70 80 90 110 120 10 20 100
sensors 6 freescale semiconductor mpx4115 series package dimensions case 867-08 issue n basic element (a, d) case 867b-04 issue g pressure side ported (ap, gp) pin 1 f g n l r 123456 6 pl d seating plane -t- m a m 0.136 (0.005) t positive pressure (p1) c b m j s -a- style 1: pin 1. vout 2. ground 3. vcc 4. v1 5. v2 6. vex style 3: pin 1. open 2. ground 3. +vout 4. +vsupply 5. -vout 6. open style 2: pin 1. open 2. ground 3. -vout 4. vsupply 5. +vout 6. open max millimeters inches 16.00 13.56 5.59 0.84 1.63 0.100 bsc 2.54 bsc 0.40 18.42 30? nom 30? nom 12.57 11.43 dim a b c d f g j l m n r s min 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 max 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 min 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 notes: 1. 2. 3. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. dimension -a- is inclusive of the mold stop ring. mold stop ring not to exceed 16.00 (0.630).
sensors freescale semiconductor 7 mpx4115 series package dimensions notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. inches 0.100 bsc millimeters 2.54 bsc dim a b c d e f g j k n s v min 0.690 0.245 0.780 0.027 0.178 0.048 0.014 0.345 0.300 0.220 0.182 max 0.255 0.820 0.033 0.186 0.064 0.016 0.375 0.310 0.240 0.720 0.194 min 17.53 6.22 19.81 0.69 4.52 1.22 0.36 8.76 7.62 5.59 4.62 max 18.28 6.48 20.82 0.84 4.72 1.63 0.41 9.53 7.87 6.10 4.93 style 1: pin 1. v out 2. ground 3. v cc 4. v1 5. v2 6. v ex a 654321 c k n e -b- port #1 positive pressure (p1) j -t- s g f d 6 pl pin 1 m b m 0.13 (0.005) t v case 867e-03 issue d pressure side ported (as, gs) style 1: pin 1. v out 2. ground 3. v cc 4. v1 5. v2 6. v ex notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. c e v j port #1 positive pressure CtC CpC m q m 0.25 (0.010) t d f g 6 pl k s pin 1 u a r b CqC n s p m 0.13 (0.005) q s t 654321 dim min max min max millimeters inches a 1.080 1.120 27.43 28.45 b 0.740 0.760 18.80 19.30 c 0.630 0.650 16.00 16.51 d 0.027 0.033 0.68 0.84 e 0.160 0.180 4.06 4.57 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.41 k n 0.070 0.080 1.78 2.03 p 0.150 0.160 3.81 4.06 q 0.150 0.160 3.81 4.06 r 0.440 0.460 11.18 11.68 s 0.695 0.725 17.65 18.42 u 0.840 0.860 21.34 21.84 v 0.182 0.194 4.62 4.93 0.220 0.240 5.59 6.10 (p1) case 867f-03 issue d pressure side ported (asx, gsx)
mpx4115 rev. 5 08/2006 how to reach us: home page: www.freescale.com web support: http://www.freescale.com/support usa/europe or locations not listed: freescale semiconductor, inc. technical information center, el516 2100 east elliot road tempe, arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) www.freescale.com/support japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor lite rature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or 303-675-2140 fax: 303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2006. all rights reserved.
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